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X-ray analysis   ■   Last modified:

X-ray analysis

Non-destructiv micro focus X-Ray analysis and testing of subjects up to 160 kV can, with advantage, quickly and efficiently be carried out in HYTEK\'s laboratory.


  • Assessment of quality on, for instance, wire bonding on IC-circuits
  • Assess quality of solder connections, for instance voids
  • Analyse hidden solder connections, for instance PBGA, BGA, µBGA etc.
  • Analyse the construction of products
  • Measuring of hidden connections etc.
  • Void calculations
Complete confidentiality is guaranteed.



  • Reports containing the necessary documentation and recommendations
  • Reports are prepared in Danish and in English by request
HYTEK®   ■   Sofievej 61   ■   DK-9000 Aalborg   ■   Telephone no.: +45 9811 7003   ■   hytek@hytekaalborg.dk   ■   SE: 17041584   ■   EAN: 5798000562028