English
Dansk
X-ray analysis
Non-destructiv micro focus X-Ray analysis and testing of subjects up to 160 kV can, with advantage, quickly and efficiently be carried out in HYTEK\'s laboratory.
Advantages
- Assessment of quality on, for instance, wire bonding on IC-circuits
- Assess quality of solder connections, for instance voids
- Analyse hidden solder connections, for instance PBGA, BGA, µBGA etc.
- Analyse the construction of products
- Measuring of hidden connections etc.
- Void calculations
Documentation
- Reports containing the necessary documentation and recommendations
- Reports are prepared in Danish and in English by request