Many companies today work with BGA, Flip Chip or similar component housings, because the technology can help to improve PCB space utilization. Other companies are uncertain about the first steps, e.g. because the hidden solder connections on these component types make visual inspection difficult.
On this course, the participants gain useful knowledge about this technique, so that they can introduce the technology in their productions.
The course is aimed at employees in the engineering, design and production departments.
There are currently no dates available for this course.
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