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Thickness measurement and material analysis (XRF)

X-ray Fluorescence (XRF) is a very precise analytical technique, used to non-destructive measurement of e.g. surface finish thickness of contact or soldering areas on PCB or component terminations.

The equipment can also be used for elemental identification and calculation of materials (material composition). 


XRF can, for example, be used for examination and analysis of:

  • Components
    • Thickness of surface finish in contact area e.g. connector pins
    • Component surface finish for soldering
    • Component surface finish for crimping
  • Printed Circuit Boards (PCB)
    • Thickness of PCB surface finish e.g. ENIG (Electroless Nickel (Ni) Immersion Gold (Au))
    • Ni: 3-6µm / Au: 50nm

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