Since the wave soldering process typically is one of the final stages of production, control and process optimization are important factors to consider in order to achieve a low failure rate.  

The course is a mix between theory and practice. Participants will be working with process control and management of critical parameters, such as verification of flux and temperature profile.

The course will, among other subjects, be focusing on these main topics:

• PCB design – HMT/SMT
• PCB
  • CTE and Tg
  • Solderability – IPC J-STD-003
• Components
  • PSL – IPC J-STD-075
  • Solderability – IPC J-STD-002
• Flux
  • Flux types in general – IPC J-STD-004
  • Flux amount and degree of coverage
  • Control measurement of flux
    • Density measurement and titration
• Solder metal
  • Types in general – IPC J-STD-006
  • Solder analysis
• Temperature profile
  • Components (PSL)
  • Thermal properties of PCB
  • Placement and attachment of sensors
• Atmosphere with and without nitrogen
  • Soldering with nitrogen
  • Oxygen level (ppm)
  • Nitrogen consumption
  • Pros and cons of introducing nitrogen
• Cleanliness
  • Cleanliness test
  • SIR test
• Process management according to IPC-J-STD-001
• Failure analysis and corrective actions

The course is aimed at production employees who have a basic understanding of the wave soldering process (the basic wave soldering course) and need extended wave soldering skills, as well as at employees in the engineering and design departments.