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Thermal mechanical analysis (TMA)

Thermal Mechanical Analysis (TMA) is a measurement method used to accurately measure, for example, the coefficient of thermal expansion (CTE) in materials. Temperature-dependent changes in materials are of great importance for the lifetime and reliability of electronics, for example in printed circuit board (PCB) laminates, where the method can be used to measure the CTE and Tg (Glass Transition Temperature) in the PCB laminate.


Example of standards for TMA:

  • ECSS-Q-ST-70-60C
  • IPC-A-600
  • IPC-6010 Serien
  • IPC-TM-650 Method 2.4.24
  • ISO 11359-1
  • MIL-STD-883

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