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Decapsulation can be used to remove moulding material from e.g. electronics components, to investigate internal elements.

The method can e.g. be used to investigate counterfeit components bought on the “grey market”, and can be a part of the analysis of original/genuine or counterfeit of the components.


Decapsulation can, for example, be used for examination and analysis of:

  • Counterfeit investigations (for example type and manufacturer logo)
  • Internal bonding (quality) in electronic components
  • ESD (Electrostatic discharge) damage
  • EOS (Electrical overstress) damage

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