How are moisture-sensitive components and PCBs specified, identified and handled?

Many companies have, at some point, experienced defects that at first sight are not associated with material moisture absorbtion. Others have experienced that incorrect handling has led to defective components, in which delamination has occurred between the plastic material and the die or lead-frame/substrate.

To avoid extensive and expensive failure analyses, it is recommended to use the following standards: IPC J-STD-020 (Classification of moisture-sensitive components), IPC J-STD-075 and IPC J-STD-033 (Handling of moisture-sensitive components). These standards will be reviewed in the course.

Depending on the choice of material, printed circuit boards can be more or less sensitive to moisture. Therefore, it is important to specify, handle and store printed circuit boards correctly.

The course will, among other subjects, be focusing on these main topics:

• Components
  • Component specification
  • Handling and storage methods
  • Moisture classification levels for components
  • Shelf life
  • Baking of components
  • Requirements for "Moisture barrier bag" and "dry packaging"
  • Identification labels for moisture-sensitive components
  • Qualification reflow profiles
  • The component's peak reflow temperature
  • Compatibility with lead-free rework
  • Failure criteria
• Printed circuit board
  • Handling and storage methods (IPC-1602)
  • Baking
  • Solderability
  • Shelf life

The course is aimed at employees in warehouse, production, PT and development departments.