The processes of reflow soldering are just as error prone as those being used in wave soldering. The only difference is that the failures related to reflow are less visible. Laboratory studies show that incorrect handling of the soldering process and incorrectly set parameters are responsible for many latent defects.

The course is a mix between theory and practice. The participants will be working with optimization of production through process management and material control. In addition, the lead-free reflow soldering process is an integrated part of the course.

The course will, among other subjects, be focusing on these main topics:

• Machine types such as IR, Forced convection, Vapor Phase etc.
• PCB - design - leaded/Pin in Paste (PiP)/SMD - lead-free/leaded
• Components (PSL/MSL)
• Solderability
• Solder types - lead-free/lead-containing
• The reflow process
• Temperature profile
• Atmosphere - with/without nitrogen
• Solderability test of printed circuit boards and components
• Practical experiments with nitrogen
• Cleanliness
• Process control
• Quality requirements according to IPC J-STD-001, IPC-A-610 and other applicable standards

The course is aimed at employees in production, the engineering department and the design department.