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Solder paste screen-printing

Studies have shown that up to 70% of all defects in the process of applying solder paste are technical errors, which can be related to incorrect material selection, stencil defects or poor printing material quality.

The course increases knowledge of printing processes, materials and control methods, paving the way for an optimization of production.

The course will, among other subjects, be focusing on these main topics:

  • Solder paste types - lead-free/lead-containing
  • Stencils/screens
  • Stencil design
  • Squeegee systems
  • Printing technique
  • Process optimization
  • Analysis and control of solder paste, including solder paste test, layer thickness and control chart
  • Quality requirements according to IPC-7527 and other applicable standards

The course is aimed at employees in production, the PT department and the development department.


DKK 6,700.00

Tilgængelige datoer

Sæt flueben ud for den ønskede dato og klik på "Føj til kurv". Deltagere tilføjes efterfølgende.

26. Feb. 2025 - 27. Feb. 2025
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