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Pull test   ■   Last modified:

Pull test 

Analysis of wire bonding etc. can quickly be carried out in HYTEKs laboratory.


  • Verification of strength of adhesion on, for instance, wire bonding
  • Process start up/optimization of, for instance, bonding equipment and termination finish
  • Determination of production technical problems
Complete confidentiality is guaranteed.


  • Reports containing the necessary documentation and recommendations
  • Reports are prepared in Danish and in English by request
HYTEK®   ■   Sofievej 61   ■   DK-9000 Aalborg   ■   Telephone no.: +45 9811 7003   ■   hytek@hytekaalborg.dk   ■   SE: 17041584   ■   EAN: 5798000562028