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X-ray inspection

X-ray inspection is a highly accurate analytical method that can be used for non-destructive inspection (NDT) of electronics.

HYTEK uses a real-time high-resolution (0.3µm spot) X-ray equipment with a digital detector that gives precise and sharp images and reveals even small details.

X-ray can, for example, be used for examination and analysis of:

Components
- Assembly quality of components e.g. batteries, semiconductors (IC etc.)
- Detection of internal defects in components
- Detection of foreign objects (FOD) in components
Printed circuit boards (PCB)
- Assembly quality on PCB e.g. soldering defects
- Internal/hidden PCB defects e.g. annular ring break-out, missing plating, short circuits
- Detection of foreign objects (FOD) on and in laminate