Do you need an upgrade?

Explore Your Options
With a Course at HYTEK

Find Course Here

Pull test

A pull or peel test can measure the strength/force in an item or in an assembly by a controlled linear pull. The pull or peel test can be used in many different solutions, and the result is typically given in newton meters.

The test can be performed on different types of items e.g. as process control for wire crimp.

HYTEK can provide both Pull and peel test of different items.

            

The pull/peel test can, for example, be used for examination and analysis of:

  • Components:
    • Wire crimp
    • Press-fit components
    • Solder connections
  • PCB
    • Adhesion force of PCB tracks (peel test)
    • Adhesion force of solder pads (peel/pull test)
    • Process control of attachment force between component and PCB

Complete Signup
Home Courses IPC standards IPC validation About HYTEK Company Courses Consulting assistance Contact