Shear test
Purposeful analysis of construction of materials, for instance terminations using adhesive and/or soldering, can quickly be analysed in HYTEKs laboratory.
Advantages
- Determination of strength of solder fillets
- Verification of shear force or strength on, for instance, solder balls on BGA, PBGA, µBGA etc.
- Control of connection techniques, for instance by new developments
- Determination of production technical problems
Documentation
- Reports containing the necessary documentation and recommendations
- Reports are prepared in Danish and in English by request