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Solder paste screen printing technology   ■   Last modified:

NB! Including lead and lead-free process

Analyses have shown that up to 70 % of all defects in the solder paste application processes are screen printing defects which may be caused by incorrect choice of materials, defects on stencils or PCB materials of insufficient quality.

During the course the knowledge of printing processes, materials and methods for inspection is increased in order to pave the way for production optimisation. In addition, lead-free printing process is an integrated part of the course.

Among other things, the following will be focused on:

  • Types of solder pastes - lead-free/leaded
  • Stencils/screens
  • Screen printing in practical
  • Process optimization
  • PCB and aperture - design
  • Analysis and inspection of solder paste, including testing and analysing solder paste, thickness measurement and SPC/control charts
  • Requirements for quality according to IPC and other specifications
The course is designed for employees in the production, production technical department and department for development.

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Price per participant: DKK 6.400 including course materials, refreshments and lunch.

Please contact HYTEK for course dates
HYTEK®   ■   Sofievej 61   ■   DK-9000 Aalborg   ■   Telephone no.: +45 9811 7003   ■   hytek@hytekaalborg.dk   ■   SE: 17041584   ■   EAN: 5798000562028