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Chip on board

Chip on board makes the electronics take up less space and weigh less. Many companies, for whom microelectronics are a necessity, demand knowledge about the technique.

The course is theoretical and provides a good starting point for implementing Chip on Board and for process optimization in companies that use the technique.

The course will, among other subjects, be focusing on these main topics (theoretically):

  • Components (dice, SMD, etc.)
  • Substrate materials (PCB, ceramics, etc.)
  • Conductive and non-conductive glues
  • Application of glue
  • Assembly process (die-bonding)
  • Wire types
  • Wire bonding
  • Coating
  • Process control

The course is aimed at employees in production, the engineering department and the design department.


DKK 3,900.00

Der er p.t. ingen tilgængelige datoer for dette kursus.

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